Cu surfaces with controlled structures: From intrinsically hydrophilic to apparently superhydrophobic

Keke Meng,Yue Jiang,Zhonghao Jiang,Jianshe Lian,Qing Jiang
DOI: https://doi.org/10.1016/j.apsusc.2013.11.075
IF: 6.7
2014-01-01
Applied Surface Science
Abstract:•Four kinds of Cu films with multi-level hierarchical surface structures were fabricated by the one-step electric brush-plating technique.•Increasing surface roughness could produce a wetting transition from the Wenzel regime to the Cassie regime.•The Cu film under the lowest plating voltage shows a superhydrophobic behavior.•Two surface geometrical parameters, spacing factor and aspect ratio, can be used to design robust superhydrophobic surfaces.
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