Preparation of a Cu Surface with the Hierarchical Structure of a Lotus Leaf Via Electroplating and Its Superhydrophobicity

Kai Chen,Tianchi Wang,Yizhuo Zhao,Zhe Zhou,Ziheng Liu,Jian Kong,Hongfu Xiang
DOI: https://doi.org/10.2320/matertrans.m2017139
2017-01-01
MATERIALS TRANSACTIONS
Abstract:A lotus leaf exhibits excellent superhydrophobic properties because of its hierarchical microstructure and a waxy hydrophobic material covering its surface. Herein, the lotus leaf was used as a template and a copper surface layer with a microstructure similar to the lotus leaf was prepared by electroplating. Experimental results show that the plating samples saved micron-sized structure of the lotus leaf, such as papillae. At the same time, owing to the specificity of the electroplating method, smaller grains were formed as the second-level structure on the papillae, forming a hierarchical structure that makes it possible to obtain a superhydrophobic surface. The plated copper surface exhibited excellent hydrophobic properties with a contact angle of 160 degrees, which is higher than that of the lotus leaf (157 degrees) and also much higher than that of smooth copper covered with an identical fluroalkyl silane (112 degrees). This affords a novel idea for preparing of superhydrophobic surfaces.
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