Abstract:Silicon nanophotonics, with its high-speed, low-loss optical interconnects, and high computation capabilities, is seen as one of the promising technologies that can easily enable the transition from low data computation systems to high data computation systems. By providing faster and more energy-efficient communication, silicon nanophotonics is helping to drive the development of more powerful and efficient computing systems that can handle larger amounts of data. These advantages of silicon nanophotonics have been leveraged by academia and industry to design the alternative for electrical interconnects, i.e., Optical Network-on-Chip (ONoC). The ONoCs offer higher bandwidth and lower power consumption communication framework as compared to the electrical interconnects. It is expected that the electrical interconnects will continue to be replaced by optical interconnects as the demand for higher bandwidth and faster communication continues to grow. However, there are some challenges in the design of optical interconnects, some of which are attributed to the intrinsic nature of silicon nanophotonic devices such as fabrication challenges and some are associated solely with the ONoCs such as high static power consumption. The research community has been actively involved in handling these challenges in order to fully realize the silicon nanophotonics for communication and computation. In this research article, we present a comprehensive survey of the current state-of-the-art ONoCs, including their design, fabrication, and performance. We also provide an overview of the significant challenges and limitations associated with ONoCs and discuss potential solutions. The goal of this survey is to provide a comprehensive overview of the field and to inform future research directions in the area of ONoCs.

Impact of Thermal Effect on Reliability in Optical Network-on-Chip

Reliability Modeling and Management of Nanophotonic On-Chip Networks

Power-and thermal-aware mapping for NoC under latency constraint

Thermal Aware Design Method for VCSEL-Based On-Chip Optical Interconnect

Silicon Photonic Network-on-chip and Enabling Components

Countering Variations and Thermal Effects for Accurate Optical Neural Networks.

Reliability-Aware Design Flow for Silicon Photonics On-Chip Interconnect

Alleviating Thermal Constraints While Maintaining Performance Via Silicon-Based On-Chip Optical Interconnects

Thermal-Aware Placement And Routing For 3d Optical Networks-On-Chips

THz Interconnect for Inter-/Intra-chip Communication

Process Variation and Temperature-Aware Full Chip Oxide Breakdown Reliability Analysis.

Device Modeling and System Simulation of Nanophotonic On-Chip Networks for Reliability, Power and Performance

Alleviating Thermal Constraints While Maintaining Performance Via Silicon- Based On-chip Optical Interconnects

Towards efficient on-chip communication: A survey on silicon nanophotonics and optical networks-on-chip

Report on power, thermal and reliability prediction for 3D Networks-on-Chip

A Survey of On-Chip Optical Interconnects

A Survey on Optical Network-on-Chip Architectures

On-chip Optical Interconnect for Reduced Delay Uncertainty

Exploration of Neural Network-based Joint Method of Mapping and Wavelength Assignment in Optical Network-on-Chip (ONoC)

Two-Dimensional Analysis Photothermal Properties in Nanoscale Plasmonic Waveguides for Optical Interconnect

Thermal Modeling, Characterization And Management Of On-Chip Networks