Investigation on Condition Monitoring of Convertor

Sheng You Xu,Min You Chen,Li Ran
DOI: https://doi.org/10.4028/www.scientific.net/amm.347-350.89
2013-01-01
Applied Mechanics and Materials
Abstract:Packaging-related failure has been recognized as one of the principal root causes of convertor failures, condition monitoring is a cost-effective means of improving convertor reliability by power electronic system operator. In this paper, an approach is presented to monitor failure by identifying the case temperature. Firstly, the case temperature is measured at real-time, the transient curves are built based on the measured data respectively. Then, extracting the slope of case temperature from the transient curve during its operation. It is because that the external characteristic of convertor is the reflection of internal condition, once the slope value of the transient curve is higher than that of the normal condition at the same working point, taking account of the masking effect of measuring accuracy and errors, a conclusion can be get that the convertor condition is abnormal. Finally, experiment has validated the proposed method.
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