Abstract:According to the requirements on minimizing the package size, guaranteeing the performance uniformity and improving the manufacturing efficiency in LEDs, a Chip Scale Packaging (CSP) technology has been developed to produce white LED chips by impressing a thin phosphor film on LED blue chips. In this paper, we prepared two types of phosphor-converted white LED CSPs with high color rendering index $(\mathbf{CRI} > 80, \mathbf{CCT}\sim 3000$ K and 5000K) by using two mixed multicolor phosphor materials. Then, a series of testing and simulations were conducted to characterize both short- and long-term performance of prepared samples. A thermal analysis through both IR thermometry and electrical measurements and thermal simulation were conducted first to evaluate chip-on-board heat dissipation performance. Next, the luminescence mechanism of multicolor phosphor mixtures was studied with the spectral power distribution (SPD) simulation and near-field optical measurement. Finally, the extracted features of SPDs and electrical current-output power (I-P) curves measured before and after a long-term high temperature accelerated aging test were applied to analyze the degradation failure mechanisms. The results of this study show that: 1) The thermal management for prepared CSP samples provides a safe usage condition for packaging materials at ambient temperature; 2) The Mie theory with ray-tracing simulation can be used to simulate the SPD of Pc-white LEDs with mixed multicolor phosphors; 3) The degradation failure mechanisms of Pc-white LEDs can be determined by analyzing the extracted features of SPDs collected after aging.

Near-/Mid-Field Effect of Color Mixing for Single Phosphor-Converted Light-Emitting Diode Package

Selection of Remote Phosphor Led Packages for Improving Luminous Flux

Influence of Phosphor Particle Size on Visual and Non-Visual Performances of White Light-Emitting Diodes for General Lighting

Optical design for uniform color mixing illumination system

Thermal, optical and electrical analysis on phosphor-converted white LED Chip Scale Packages with both experiment and simulation

Spectral Re-Absorption Effect of Multi-Primary Phosphor Thin Films and Various Package Structures on the Performance of Near-Ultraviolet White LED

Study on the Performance of Deep Red to Near-Infrared pc-LEDs by the Simulation Method Considering the Distribution of Phosphor Particles

Uniform illumination design by configuration of LEDs and optimization of LED lens for large-scale color-mixing applications.

Near-Infrared Nanophosphors Based on CuInSe2 Quantum Dots with Near-Unity Photoluminescence Quantum Yield for Micro-LEDs Applications

Excellent color quality of phosphor converted white light emitting diodes with remote phosphor geometry

Effect of particle sizes and mass ratios of a phosphor on light color performance of a green phosphor thin film and a laminated white light-emitting diode

Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules

‘Flip Glass Substrate’ Package Technology for LED Yield and Performance Enhancement

Effective freeform TIR lens designed for LEDs with high angular color uniformity

Effect of Amorphous Photonic Structure Surface Mounted on Luminous Performances of White LED

Characterization, packaging, and optical model of single-primary color phosphor thin films and LEDs

Low blue light hazard for tunable white light emitting diode with high color fidelity and circadian performances

Research on Scattering Properties of Phosphor for High Power White Light Emitting Diode Based on Mie Scattering Theory

Influence of Phosphor Layers with Different Shapes on White LED's CCT Uniformity in Space

Multicolour LED lighting achieved by an array phosphor-converted film and blue-LED chip

Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging