Abstract:According to the requirements on minimizing the package size, guaranteeing the performance uniformity and improving the manufacturing efficiency in LEDs, a Chip Scale Packaging (CSP) technology has been developed to produce white LED chips by impressing a thin phosphor film on LED blue chips. In this paper, we prepared two types of phosphor-converted white LED CSPs with high color rendering index $(\mathbf{CRI} > 80, \mathbf{CCT}\sim 3000$ K and 5000K) by using two mixed multicolor phosphor materials. Then, a series of testing and simulations were conducted to characterize both short- and long-term performance of prepared samples. A thermal analysis through both IR thermometry and electrical measurements and thermal simulation were conducted first to evaluate chip-on-board heat dissipation performance. Next, the luminescence mechanism of multicolor phosphor mixtures was studied with the spectral power distribution (SPD) simulation and near-field optical measurement. Finally, the extracted features of SPDs and electrical current-output power (I-P) curves measured before and after a long-term high temperature accelerated aging test were applied to analyze the degradation failure mechanisms. The results of this study show that: 1) The thermal management for prepared CSP samples provides a safe usage condition for packaging materials at ambient temperature; 2) The Mie theory with ray-tracing simulation can be used to simulate the SPD of Pc-white LEDs with mixed multicolor phosphors; 3) The degradation failure mechanisms of Pc-white LEDs can be determined by analyzing the extracted features of SPDs collected after aging.

Influence of Phosphor Layers with Different Shapes on White LED's CCT Uniformity in Space

Novel Measurement System and Analytical Method for White LED Phosphors

Numerical Research of High Viscosity Phosphor Flow Field Distribution of High-Power LED Phosphor Coating Process

Research on Scattering Properties of Phosphor for High Power White Light Emitting Diode Based on Mie Scattering Theory

Influence of Phosphor Particle Size on Visual and Non-Visual Performances of White Light-Emitting Diodes for General Lighting

Effect of particle sizes and mass ratios of a phosphor on light color performance of a green phosphor thin film and a laminated white light-emitting diode

Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules

Thermal, optical and electrical analysis on phosphor-converted white LED Chip Scale Packages with both experiment and simulation

Study on LED array heat transfer under natural convection based on CFD

Spectral Re-Absorption Effect of Multi-Primary Phosphor Thin Films and Various Package Structures on the Performance of Near-Ultraviolet White LED

Uniform illumination design by configuration of LEDs and optimization of LED lens for large-scale color-mixing applications.

Optical Model of Laminated Remote Phosphor Films and Its Application in White LED

Physical Limitations of Phosphor layer thickness and concentration for White LEDs

Selection of Remote Phosphor Led Packages for Improving Luminous Flux

Excellent color quality of phosphor converted white light emitting diodes with remote phosphor geometry

Characterization and Measurement of White LED Phosphors

Optical design for uniform color mixing illumination system

High Stability Carbon Dots Phosphor and Ultra-High Color Rendering Index White Light-Emitting Diodes

Study on Color Temperature Tunable Four-Chips White LEDs

Composition and structure design of three-layered composite phosphors for high color rendering chip-on-board light-emitting diode devices

Effect of Amorphous Photonic Structure Surface Mounted on Luminous Performances of White LED