Abstract:For spot scanning dark-field scattering technology, the defocus caused by the change in wafer surface height decreases the defect detection rate and size measurement repeatability. The demand for accurately and rapidly measuring the wafer surface height online is becoming increasingly urgent. The defect detection system integrates scattering, reflection, film, and topography defect detection channels. The integration of laser-triangulation-based defocus measurement into the bright-field optical path is proposed. The laser beam is directed onto the surface of the wafer, and the reflected light is transmitted through a lens onto the photosensitive surface of a four-quadrant detector. This detector captures both the strength and position of the reflected signal simultaneously. In this paper, a triangulation-modified model is established to obtain the height of each inspection spot on the wafer surface through the position signal of the reflected image. When the signal-to-noise ratio of the simulated reflection image position is 20 dB, the signal-to-noise ratio of the height measurement resolved by the triangulation-modified model is 41 dB, and the measurement error is less than 0.2 μm, indicating that the model has a noise suppression effect. The spot-scanning imaging system is established, and the height measurement results of the triangulation measurement model are verified using a laser interferometer. Within the travel range of 69 μm, the system has a measurement accuracy better than ±1 μm and a measurement repeatability better than ±0.2 μm, which meet the measurement requirements of the spot scanning imaging system. The system is utilized for defect detection and defocus measurement of the wafer surface, along with the motion mechanism, to accurately and rapidly obtain the height distribution of the wafer surface.

Sub-Millimeter Servo System for Sample Positioning Based on Thresholding of Defocused Laser Spot

A High-Precision Five-Degree-Of-Freedom Measurement System Based on Laser Collimator and Interferometry Techniques

Nano-Displacement Measurement Based On Virtual Pinhole Confocal Method

Axial nano-displacement measurement with high resolution and wide range based on asymmetrical illumination.

High-precision laser alignment technique based on spiral phase plate

Study of the Method for Measuring Four-Degree-of-Freedom Geometric Errors of a Linear Stage

Airborne Laser Communication System with Automated Tracking

Laser Spot Center Detection and Comparison Test

Dynamic Confocal Optical Probe Based on Time Difference Measurement

Development of Large Range Nano-Positioning System Used in Metrological Scanning Microscope

Research on High-Precision Position Detection Based on a Driven Laser Spot in an Extreme Ultraviolet Light Source

Image-Based Auto-Focus Microscope System with Visual Servo Control for Micro-Stereolithography

Dual-Servo Mechanism of STM for Measurement of Sub Millimeter Deep Trench Structures

Embedded displacement measuring device based on error separating technique of multi-circle overlapping three-probe method

A Novel Wafer Defocus Measurement Method for Spot-Scanning Imaging System Using Laser Triangulation

Design and Analysis of a Long-Stroke and High-Precision Positioning System for Scanning Beam Interference Lithography

Chromatic Confocal Sensor-Based Sub-Aperture Scanning and Stitching for the Measurement of Microstructured Optical Surfaces.

Laser Confocal Feedback Profilometry

Least-Square-Method-Based Optimal Laser Spots Acquisition and Position in Cooperative Target Measurement

CCD Vision Based Surface Geometry Tracking for Real Time Navigation of CNC Machining

Ccd-Based System For Three-Dimensional Real-Time Positioning