Rapid and low-cost prototyping of 3D nanostructures with multi-layer hydrogen silsesquioxane scaffolds

Leo Tom Varghese,Li Fan,Jian Wang,Yi Xuan,Minghao Qi
DOI: https://doi.org/10.1002/smll.201301658
IF: 13.3
2013-01-01
Small
Abstract:A layer-by-layer (LBL) method can generate or approximate any three-dimensional (3D) structure, and has been the approach for the manufacturing of complementary metal-oxide-semiconductor (CMOS) devices. However, its high cost precludes the fabrication of anything other than CMOS-compatible devices, and general 3D nanostructures have been difficult to prototype in academia and small businesses, due to the lack of expensive facility and state-of-the-art tools. It is proposed and demonstrated that a novel process that can rapidly fabricate high-resolution three-dimensional (3D) nanostructures at low cost, without requiring specialized equipment. An individual layer is realized through electron-beam lithography patterning of hydrogen silsesquioxane (HSQ) resist, followed by planarization via spinning SU-8 resist and etch-back. A 4-layer silicon inverse woodpile photonic crystal with a period of 650 nm and a 7-layer HSQ scaffold with a period of 300 nm are demonstrated. This process provides a versatile and accessible solution to the fabrication of highly complex 3D nanostructures.
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