Abstract:Copper (Cu) is an important interconnect metal material in the semiconductor field. While removing excess copper in the chemical mechanical polishing process, it is necessary to add corrosion inhibitors to the slurry to protect copper from excessive corrosion. Numerous studies have shown that the heteroatoms and functional groups of corrosion inhibitors are crucial factors affecting their corrosion inhibition ability. The corrosion inhibition performance of benzimidazole (BI) and its two derivatives, 5-methyl benzimidazole (MBI) and 5-methyl benzotriazole (MBTA), on copper in glycine + N-methylglycine solution at pH 9 was studied, and their structure-activity relationship was revealed. Electrochemical measurements and adsorption isotherm fittings show that the three corrosion inhibitors cover the copper surface mainly through the chemisorption to prevent the anodic reaction of copper. The corrosion inhibition efficiencies of BI, MBI, and MBTA were 97.22%, 98.00% and 98.73% at the concentration of 8 mM, respectively, reaching their maximum values. The contact angle testing reveals that MBI and MBTA containing methyl groups are relatively more hydrophobic. X-ray photoelectron spectroscopy (XPS), atomic force microscope (AFM) and scanning electron microscope (SEM) results confirm that the three corrosion inhibitors were successfully adsorbed on the copper surface and formed a dense passivation film to protect the copper from corrosive solutions. In addition, a multi-module collaboration with density functional theory (DFT) and molecular dynamics (MD), further demonstrates that BI, MBI, and MBTA are all adsorbed on the copper layer in a mixed way, and MBTA has the strongest binding capacity to copper. The introduction of the methyl and N atom increased the adsorption area and attachment sites between the corrosion inhibitor and copper, which coincides with the experimental results.

Benzotriazole As a Volatile Corrosion Inhibitor During the Early Stage of Copper Corrosion under Adsorbed Thin Electrolyte Layers

Adsorption and protective behavior of BTAH on the initial atmospheric corrosion process of copper under thin film of chloride solutions

Theoretical and electrochemical analysis on inhibition effects of benzotriazole derivatives (un- and methyl) on copper surface

Studies of Benzotriazole on and into the Copper Electrodeposited Layer by Cyclic Voltammetry, Time-of-Flight Secondary-Ion Mass Spectrometry, Atomic Force Microscopy, and Surface Enhanced Raman Spectroscopy

Chloride-Assisted Corrosion of Copper and Protection by Benzotriazole

Inhibition Mechanism of Benzotriazole in Copper Chemical Mechanical Planarization

Influence of Ph, Immersion Time, and Benzotriazole Concentration on Copper Corrosion in Citric Acid Based Slurries

Corrosion inhibition effect of benzimidazole and two derivatives on copper in alkaline environments: experimental and theoretical analyses

Insight into the anti-corrosion mechanism of 2-aminobenzenethiol as the inhibitor for copper in acid environment

Adsorption Dynamics Of Benzotriazole On Copper In Chloride Solution

Understanding corrosion inhibition with van der Waals DFT methods: the case of benzotriazole

Molecular dynamics analysis of adsorption process of anti-copper-corrosion additives to the copper surface

Synergistic inhibition of azoles compounds on chloride-induced atmospheric corrosion of copper: Experimental and theoretical characterization

3,5‐Bis(2‐thienyl)‐4‐amino‐1,2,4‐triazole As a Corrosion Inhibitor for Copper in Acidic Media

Investigation on the Mechanisms of Corrosion Inhibitor 5-aminotetrazole Used in the Copper Chemical Mechanical Polishing

Composite protective effect of benzotriazole and 2-mercaptobenzothiazole on electroplated copper coating

SERS, XPS, and Electroanalytical Studies of the Chemisorption of Benzotriazole on a Freshly Etched Surface and an Oxidized Surface of Copper

The Unexpected Role of Benzotriazole in Mitigating Magnesium Alloy Corrosion: A Nucleating Agent for Crystalline Nanostructured Magnesium Hydroxide Film

Effect of Corrosion Inhibitor in the Chemical Mechanical Polishing of Copper

Adsorption behavior and corrosion inhibition performance of tetrazolium derivatives on electrolytic copper foil surface

Adsorption Mechanism of Benzotriazole on Copper Surface in CMP Based Slurries Containing Peroxide and Glycine