Influence of Ph, Immersion Time, and Benzotriazole Concentration on Copper Corrosion in Citric Acid Based Slurries

XiaoRen Lü,XinChun Lu,JianBin Luo
DOI: https://doi.org/10.1007/s11434-011-4420-4
2011-01-01
Abstract:Copper corrosion in citric acid based slurries with or without benzotriazole (BTA) was investigated as a function of the slurry pH, immersion time and BTA concentration by static etching and electrochemical experiments. The chemical composition of the corroded surface was determined using X-ray photoelectron spectroscopy (XPS). The static etching rate of copper in a H2O2+citric acid+BTA slurry was lower than that in a H2O2+citric acid slurry at pH 4.4–8. When the pH of the slurry was >8 or <4.4, the results were reversed and the static etching rate of copper increased when BTA was added to the H2O2+citric acid slurry. The inhibitory effect of BTA in the H2O2+citric acid slurry at pH 6 increased with the increasing immersion time of the copper. The corrosion current density of copper gradually decreased with increasing BTA concentration in slurry.
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