Performance Improvement of Reactive Magnetron Sputtering ZnO-TFT after Annealing in N2 Ambient

Hui-Kun Yao,Lei Sun,You-Feng Geng,Yong-Qi Li,Yu-Qian Xia,Jian Cai,Wen-Tong Zhu,De-Dong Han
DOI: https://doi.org/10.1109/icsict.2012.6466745
2012-01-01
Abstract:Bottom-gated ZnO-TFTs have been fabricated under different conditions, and the devices' current-voltage properties are reported. The ZnO films are prepared by reactive magnetron sputtering, and then annealed in N2 ambient at 300°C for 1hour. The characteristics of the surface morphologies and microstructures of the samples were studied respectively. We also studied the effect of N2 annealing on the samples' physical structures and electrical characteristics. After annealing, the experimental results show that ZnO-TFTs can exhibit excellent electrical properties while Vg changes from -10 to 70V, and Ion/Ioff ratio is larger than 106 and OFF-state current is smaller than 1.2×10-10A as Vd=10V.
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