Numerical simulation of the gap flow field for CEDMMG compound machining engineering ceramics

Renjie Ji,Yonghong Liu,Chao Zheng,Fei Wang,Yanzhen Zhang,Yang Shen,Baoping Cai
2012-01-01
Abstract:Engineering ceramics are introduced to satisfy the requirements of high-precision manufacturing industries. However, they are difficult to machine due to their high strength, high hardness, high toughness and high thermal resistance. In this paper, the circumferential electrical discharge milling and mechanical grinding (CEDMMG) compound machining process is presented. The high material removal rate and good surface quality of machining engineering ceramics with the compound process can be obtained. Moreover, the gap flow field of the compound process is numerically simulated based on the liquid-solid two-phase flow theory. The results show that the working fluid flow can be accelerated, and the machining debris can be ejected timely due to the rapid rotation of the tool, so the process performance can be enhanced. © 2012 IFSA.
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