Abstract:In this study, the line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects were used to determine the growth kinetics of interfacial intermetallic compounds (IMCs) under electromigration (EM), and the current crowding effect and thermomigration are expected to be avoided in this line-type interconnects because of their symmetric structure. The Cu/Sn/Cu interconnect was under the current density of 5.0×10 3 A/cm 2 at 100 °C and 150 °C, and the Cu/Sn/Ni interconnect was under the same current density at 150 °C. For the purpose of comparison, the Cu/Sn/Cu and Cu/Sn/Ni interconnects were aged at the same temperatures for the same durations. In the case of Cu/Sn/Cu interconnect, the same types of IMCs, Cu 6Sn 5 and Cu 3Sn, formed at the Sn/Cu interface, which was independent of electric current. EM caused a polarity effect, i.e., the interfacial IMCs on the anode side were significantly thicker than those on the cathode side. The growth kinetics of the interfacial IMCs on the anode side during EM were significantly enhanced compared with that of the aging (the no-current case), and still followed a t 1/2 law with time. The temperature was one of the critical factors that influenced the EM. The effect of EM became more significant at higher temperature under the same current density. The growth behavior of the interfacial IMCs on the cathode sides was complicated. When the initial interfacial IMCs were very thin, the inward atomic fluxes were larger than the outward fluxes and thus the interfacial IMCs grew. After the IMCs reached a critical thickness, the inward atomic fluxes were less than the outward fluxes and thus the thickness of the interfacial IMCs decreased. In the case of Cu/Sn/Ni interconnects, Ni 3Sn 4 and Cu 6Sn 5 IMCs formed at the as- soldered Sn/Ni and Sn/Cu interfaces, respectively. The Cu content in the IMCs at the Sn/Ni interface increased with the increasing aging time, and the original Ni 3Sn 4 IMC at the Sn/Ni interface transformed into (Cu 0.56Ni 0.44) 6Sn 5 after aging at 150 °C for 200h; while the IMC at the Sn/Cu interface remained Cu6Sn5, which contained less than 0.5 at% Ni even after aging at 150 °C for 200h. When electrons flowed from Cu side to Ni side in the Cu/Sn/Ni interconnects during EM at 150 oC, the original interfacial Ni3Sn4 IMC at the Sn/Ni interface (anode side) had already transformed into (CuNi)6Sn5 type after EM for 100h. After EM for 200h, (Cu0 60Ni040)6Sn5 formed at the Sn/Ni interface and Cu6Sn5 (containing less than 0.1 at% Ni) formed at the Sn/Cu interface. When the direction of electron flow was reversed, after EM at 150 °C for 200h, the types of IMCs remained unchanged, i.e., Ni 3Sn 4 (containing 2 at% Cu) and Cu 6Sn 5 (containing less than 2 at% Ni) formed at the Sn/Ni and Sn/Cu interfaces, respectively. The diffusivity of Cu atoms in Sn is two orders of magnitude higher than that of Ni in Sn. Thus, Cu atoms would easily diffuse across the bulk solder than Ni atoms and influence the interfacial reactions on both the anode and cathode sides when electrons flowed from Cu side to Ni side. However, the diffusion of Cu atoms was blocked while against the electron wind, i.e., when electrons flowed from Ni side to Cu side. © 2010 IEEE.

Effect of electromigration on interfacial reaction in Ni/Sn/Ni-P solder joint

EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS

Electromigration-induced Interfacial Reactions in Line-Type Cu/Sn/ENIG Interconnect

Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects

Effect Of Electromigration On Interfacial Reaction Of Cu/Sn3.0ag0.5cu/Ni Solder Joint At High Temperature

Effect of Electromigration on the Cu-Ni Cross-Interaction in Line-Type Cu/Sn/Ni Interconnect

Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect

Effects of Temperature and Current Density on (au, Pd, Ni)Sn4 Redistribution and Ni-P Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints

Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnects

Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects

Electromigration Effect Upon the Sn–0.7 Wt% Cu/Ni and Sn–3.5 Wt% Ag/Ni Interfacial Reactions

Reverse Polarity Effect in Ni/Sn-9zn/Ni Interconnect Undergoing Liquid-Solid Electromigration

Cu-Ni cross-solder interaction in Cu/Sn-58Bi/Ni interconnect undergoing liquid-solid electromigration

Electromigration-induced failure of Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joint

Current-induced Interfacial Reactions in Ni/Sn–3Ag–0.5Cu/Au/Pd(P)/Ni–P Flip Chip Interconnect

Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects

Electromigration effects upon the low-temperature Sn/Ni interfacial reactions

Electromigration Effects Upon Cu/Ni/Sn-Ag and Cu/Ni/Sn-Ag-Cu Interfacial Reactions

The Effects of Ni Addition on Microstructure Evolution and Mechanical Properties of Solder Joints Undergoing Solid-Liquid Electromigration

Comparative Study on the Effects of Fe and Ni Additions on the Electromigration Properties of Sn58Bi Solder Joints

Effects of current density and temperature on Sn/Ni interfacial reactions under current stressing