Abstract:In the multilayer film-substrate system, the buckling, delamination and cracking of the film caused by the thermal stress concentration point and the stress mutation are the main factors leading to the failure of the corresponding device function. In this paper, we studied the multilayer film system composed of the substrate and the three-layer film. The thermal stress distribution inside the structure was calculated by the finite element method (FEM). It was observed that there was a large thermal stress difference between the layers. This is mainly due to the mismatch of thermal expansion coefficient (CTE) between materials. Different materials have different degrees of change with the external environment temperature, and the layers are squeezed. In particular, there are obvious thermal stress concentration points at the corners of the base layer and the transition layer, which is due to the sudden change of the shape at the geometric section of the structure, resulting in a sudden increase in local stress. In order to solve this problem, we have chamfered the substrate and added an intermediate layer between the substrate and the transition layer to analyze whether the difference between the thermal stress concentration point and the thermal stress can be reduced or eliminated, and the service life of the multilayer structure can be extended. The conclusion shows that chamfering and increasing the intermediate layer can reduce the stress mutation and weaken the thermal stress concentration point, which can effectively improve the interlayer bonding strength.

Thermal Stress Analysis of a Trilayer Film/substrate System with Weak Interfaces

Analysis of the Thermal Stress in Infrared Films

Analysis of axisymmetric thermo-elastic problem in multilayered material with anisotropic thermal diffusivity

Time-dependent analysis of 3D thermo-mechanical behavior of a layered half-space with anisotropic thermal diffusivity

Axisymmetric coupled thermo-mechanical response of multilayered elastic medium

Thermal stresses in bilayer systems with weak interface

Plane strain and three-dimensional analyses for thermo-mechanical behavior of multilayered transversely isotropic materials

Modified Stoney's Formulas for Small-Scaled Bilayer Systems

Stresses in a Multilayer Thin Film/Substrate System Subjected to Nonuniform Temperature

Thermal stress reduction of bilayered systems by means of linearly graded interlayer

THERMOELASTIC ANALYSIS OF INTERFACIAL STRESS AND STRESS SINGULARITY BETWEEN A THIN FILM AND ITS SUBSTRATE

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Multilayer Thin Films/substrate System with Variable Film Thickness Subjected to Non-Uniform Misfit Strains

Thermal Stress Distributions and Optimization on Stress Reductions with Or/and Without Linearly Graded Interlayers

A Practical Approach for Determination of Thermal Stress and Temperature-Dependent Material Properties in Multilayered Thin Films

Calculation of Thermal Stress in Microstructure Fabricated by Multilayer Thin Films

Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method

Multi-layer thin films/substrate system subjected to non-uniform misfit strains

The interfacial behavior of a thermoelectric thin-film bonded to an orthotropic substrate

Effectiveness Of Compositionally Linearly Graded Interlayers For Thermal Stress Reduction