EMI Study of High-Speed IC Package Based on Pin Map

Xuequan Yu,Yadong Bai,Yan Zhou,Wei Bai,Lin Yang,Junxin Min

DOI: https://doi.org/10.1109/apemc.2012.6237855

2012-01-01

Abstract:With the ever-increasing of the speed of the integrated circuit (IC), more and more electromagnetic interference (EMI) problems have been introduced by the high-speed IC. In real engineering applications, the pin map is often employed for the high-speed IC package to reduce such EMI radiation. In this paper, firstly, we propose a simple equivalent antenna model for a 5 Gbps high-speed IC package. After that, we perform the optimization of the pin map of that package, and finally compare the shielding performance of packages before and after the optimization. To validate the proposed equivalent model and the optimization results, we design and fabricate a series of experimental boards with different pin maps, and then compare the measurement results of the radiated fields at three meter distance and the return loss before and after the optimization. We also study the radiation pattern of the package. Through the comparison between the simulation results and measurement results, the accuracy of the proposed equivalent antenna model is validated. Both the simulation and measurement results show that the pin map plays an important role to eliminate the patch antenna effect of the package, thereby greatly affects the package EMI.