Investigation of the Bonding Mechanism of Al Powder Particles through Pulse Current Sintering Technology
Zhou Lv,Ruifeng Liu
DOI: https://doi.org/10.3390/coatings14060759
IF: 3.236
2024-06-16
Coatings
Abstract:Compared with traditional powder metallurgy, pulse current sintering is an advanced powder-forming technology, but its bonding mechanism is still an open topic for debate. In this paper, pulse current sintering is used as the connection technology and millimeter-sized Al particles are used as the research object. In the whole sintering process, no pressure was loaded; the function of the pulse current was the only source of heat with which to achieve the bonding of Al particles. The bonding mechanism of pulse current sintering was investigated from the perspective of material connection behavior. The results show that the pulse current density of the particle surface reaches 3.48 × 105 A/m2 instantly, while the current density of the particle center is only 8187 A/m2 at the initial stage, which is the main difference between pulse current sintering and traditional powder metallurgy sintering. With the densification process, the current density and temperature distribution in the contact region as well as the center of Al particles contact region tend to be more consistent. Finally, dense interfacial bonding was obtained, and the contact region of Al particles also demonstrated a high hardness value of 0.6385 GPa and yield strength value of 212.83 MPa. The whole process can be considered as a comprehensive action of melting (evaporation), diffusion, and plastic deformation. Based on the above results, a new technology, named high-frequency pulse current sintering, was proposed.
materials science, multidisciplinary,physics, applied, coatings & films