Diamond-shaped Ge and Ge0.9Si0.1 gate-all-around nanowire FETs with four {111} facets by dry etch technology
Yiming Li,P. Sung,G. Huang,Wen-Fa Wu,S. Samukawa,W. Yeh,T. Tseng,Kun‐Lin Lin,Jiun-Yun Li,F. Hsueh,C. Wu,T. Hou,S. Chuang,K. Kao,Yao-Jen Lee,Bo-Yuan Chen,T. Chao,F. Hou,Henry J. H. Chen,Jay-Yi Yao,W. Yuan,Yu-Chi Lu,Hisu-Chih Chen
DOI: https://doi.org/10.1109/IEDM.2015.7409701
2015-02-16
Abstract:We propose a feasible pathway to scale the Ge MOSFET technology by using a novel diamond-shaped Ge and Ge09Si01 gate-all-around (GAA) nanowire (NW) FETs with four {111} facets. The device fabrication requires only simple top-down dry etching and blanket Ge epitaxy techniques readily available in mass production. The proposed dry etching process involves three isotropic/anisotropic etching steps with different Cl2/HBr ratios for forming the suspended diamond-shaped channel. Taking advantages of the GAA configuration, favorable carrier mobility of the {111} surface, nearly defect-free suspended channel, and improved dopant activation by incorporating Si, nFET and pFET with excellent performance have been demonstrated, including an Ion/Ioff ratio exceeding 108, the highest ever reported for Ge-based pFETs.
Materials Science,Engineering,Physics