Recognition and Alignment Technology of the RFID Wafers

WEI Ting,YIN Yue-hong
DOI: https://doi.org/10.3969/j.issn.1001-2257.2007.05.017
2007-01-01
Abstract:The paper mainly introduces the technology of recognition and alignment of wafers of the RFID packaging.The recognition of wafer is based on the algorithm for pixel labeling in the binary images.The improvement is made on the existed algorithms for detecting of connected components so that the current algorithm has few complex data structure,and is easy for caculating.After the recognition of wafers,the process of alignment counts out the centroids of the wafers,then sorts the centroids and calculates the distance between the current wafer and next wafer.Receiving the data of distance,the motors move the wafer plate.
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