Hydrophobic Silica Aerogel Films with Low Dielectric Constant via Ambient-Pressure Drying

Yao Lanfang,Yue Chunxiao,Lu Fengqin,Shen Jun,Wu Guangming
DOI: https://doi.org/10.3321/j.issn:1002-185X.2008.z2.043
2008-01-01
Rare Metal Materials and Engineering
Abstract:Hydrophobic silica aerogel films with low dielectric constant were prepared by a two-step sol-gel dip-coating procedure at ambient pressure. The as-prepared gel film was taken for solvent exchange and reaction with trimethylchlorosilane(TMCS) instead of supercritical drying. Surface modifications were identified by FTIR. Contact angle values of the films are about 120 degrees. The process was optimized by varying the dilution, aging, organic substitution, organic modification, heat treatment and dip-coating conditions. When heated in the range of 150 similar to 650 degrees C and 6% TMCS was used, hydrophobic Silica aerogel films with refractive indices of 1.08 similar to 1.12 and dielectric constants of 1.62 similar to 1.92 were synthesized.
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