Study on Fe-doped Copper Nitride Films by Reactive Magnetron Sputtering

Xingao LI,Zuli LIU,Anyou ZUO,Zuobin YUAN,Jianping YANG,Kailun YAO
DOI: https://doi.org/10.3321/j.issn:1005-023X.2006.12.039
2006-01-01
Abstract:Copper nitride film and Fe-doped copper nitride film are deposited on glass substrates by reactive magnetron sputtering at N_2-gas partial pressure of 0.5Pa and substrate temperature of 100℃. X-ray diffraction (XRD)shows that the copper nitride film growth prefers (111) direction, and the Fe-doped copper nitride film is weak crystalline. AFM (atomic force microscopy) shows that the roughness of Fe-doped copper nitride film increases. The deposition rate and the resistivity of Fe-doped Cu_3N film increase.
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