Experimental Research on the Influence of the KDP Crystal Anisotropy on Scratch Characteristics

WANG Dong,FENG Ping-fa,ZHANG Cheng-long,ZHANG Jian-fu
DOI: https://doi.org/10.16553/j.cnki.issn1000-985x.2012.03.034
2012-01-01
Abstract:Nano-scratch test has been conducted on the second harmonic generation(SHG) crystal face of KDP crystal using a diamond spherical indenter with 0°,45° and 90° scratch orientations along a scratch length of 420 μm under a ramp loading from 0 to 150 mN.The scratch morphology was observed by scanning electron microscopy.The starting transition point from brittle to ductile and the brittle and ductile removal proportion were obtained according to the scratch depth-scratch distance curve and the scratch morphology.Results showed that the transition point from brittle to ductile in 0°,45° and 90° orientation was 209.0 μm,158.5 μm and 112.6 μm.0° is the optimal processing orientation because the piece which was scratched in 0° had the latest transition point from brittle to ductile,the largest critical load and the least brittle removal during scratching.The conclusion of the grinding demonstration test was the averaged cutting force and the surface roughness were the least when the piece was machined in 0°.So it was validated that 0° is the optimal processing orientation KDP crystal SHG face.
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