Material Removal Characteristics of KDP Crystal in Ultrasonic Vibration-Assisted Scratch Process

Jianfu Zhang,Dong Wang,Pingfa Feng,Zhijun Wu,Chenglong Zhang
DOI: https://doi.org/10.1080/10426914.2015.1070423
IF: 4.7832
2015-01-01
Materials and Manufacturing Processes
Abstract:In this article, the microscale removal characteristics of potassium dihydrogen phosphate (KDP) crystal were investigated based on a developed ultrasonic vibration-assisted scratch test apparatus. The common and ultrasonic scratch tests using a Berkovich indenter were conducted in the [210], [110], and [010] crystal directions of the (001) crystal plane. The results showed significant anisotropy in the material removal characteristics for the three directions on the (001) crystal plane of the KDP crystal. The smallest mean friction coefficient and the largest mean critical depth of the brittle-ductile transition were observed in the [110] crystal direction. For the ultrasonic scratch test, the load was relatively small, the removal process was smoother, the scratch debris was small and uniform, and the ductile removal rate was higher than for the common scratch test. The critical depths of the brittle-ductile transition during the common and ultrasonic scratching processes were determined for each crystal direction. Combined with the values of the mechanical properties of KDP crystal that were obtained from the indentation tests, a calculation method for the critical depths of the brittle-ductile transition of KDP crystal during the common and ultrasonic scratch tests was discussed. This method could be used to guide the optimal selection of cutting parameters in practical machining.
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