DEVELOPMENTS AND PRESENT SITUATION OF DIFFUSION BONDING OF TITANIUM ALLOY TO OTHER METALS

宋敏霞,赵熹华,郭伟,冯吉才
DOI: https://doi.org/10.3969/j.issn.1001-1382.2005.01.002
2005-01-01
Abstract:The diffusion bonding technique of titanium or titanium alloy and nonmetals is one of the central issues in materials bonding field now.The research status and development of diffusion bonding titanium or titanium alloy and nonmetals ( graphite and semiconductor) was reviewed in this paper, which placed emphasis on the interface reaction and bonding technology as well as the advantage, limitation, and the trend of its development was analyzed.
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