Abstract:It is well known that the thermal expansion coefficient of the cladding layer can significantly influence the stress induced birefringence in arrayed waveguide gratings. For the first time, the so-called cladding layer is divided to two parts, i. e. upper cladding and interlayer. The effects of the thermal expansion coefficient, the Young's modulus and the Poisson's ratio of the interlayer, the upper cladding layer and the buffer layer on thermal stresses in buried channel silica-on-silicon optical waveguide cores are studied by use of finite element simulation. The results show that the interlayer between waveguide cores plays the most important role in determining thermal stresses of waveguide cores. The influences of the upper cladding layer and the buffer layer are small, though the former affects slightly larger than the later. By adjusting the thermal expansion coefficient of the interlayer instead of the cladding layer, it is faster to minimize the stress induced birefringence, and the thermal stresses around waveguide cores are almost symmetry. It is also shown that the thermal stress effects of the thermal expansion coefficient and the Poisson's ratio on the cladding layer can be considered as linear superposition of those on the interlayer and the upper cladding layer. However, this conclusion is unsuitable for Young's modulus because of big coupling effect when the thermal expansion coefficient of the interlayer is large. © 2008 SPIE.

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