Abstract:This work presents the manufacturing of copper‐plated ceramic nanoparticles in an environmentally friendly way. Supported by organic functionalizations with pectin an electroless plating step can be performed. Sustainable reagents like xylose, and several amino acids are used for the reduction process. The resulting particles are implemented in a PBF‐LB/M process showing the processability to create Cu oxide dispersion strengthened materials. A high demand for oxide dispersion strengthened (ODS) materials arose in wide fields of application. The electroless plating method has been presented as an elegant way to overcome different surface energies and obtain metal‐plated ceramics. However, copper electroless plating is still performed under harsh conditions with toxic and expensive reagents, including noble metals and harsh reducing agents like formaldehyde and hydrazine. To create a pure copper metal matrix in an environmentally friendly and efficient way a previously reported method is advanced in a way that naturally occurring amino acids are utilized. A screening of several amino acids leads to an improvement in phase purity and atomic efficiency. Therefore, a Maillard type reaction with lysine as amino compound is reported to show the best results in the particle coating for all ceramic nanoparticles evaluated. The metal plating results in uniform round micro particles showing a homogeneous coating. In order to obtain copper matrix composites, the prepared particles are successfully implemented in a PBF‐LB/M process after mixing with a highly conductive copper alloy. The resulting products were investigated by transmission electron microscopy, scanning electron microscopy, powder X‐ray diffraction, and optical density measurements.

Copper Thin Coating Deposition on Natural Pollen Particles

A Catalytic Oxidation Approach to Coat Copper Powder with Polyaniline

Coating Fine Copper Powder with Polyaniline

Sugar‐Based Electroless Copper Deposition on Pectin‐Coated Alumina Microparticles

Fabrication and performance of silver coated copper powder

Focused electron beam induced deposition of copper with high resolution and purity from aqueous solutions

Electroless plating of copper on carbon fiber surfaces and corresponding mechanism

Preparation and properties of silver-coated copper powder with Sn transition layer

Maillard Type Reaction for Electroless Copper Plating onto Ceramic Nanoparticles

Electroless Copper Plating Onto Printed Lines of Nanosized Silver Seeds

PREPARATION OF TEM THIN FOIL CONTAINING POWDER PARTICLE BY ELECTRODEPOSITION METHOD

Preparation of nanoporous copper foil by chemical dealloying from electro-deposited CuZn alloy

Fabrication Of Fully Covered Cu-Ag Core-Shell Nanoparticles By Compound Method And Anti-Oxidation Performance

Microstructure and properties of copper plating on citric acid modified cotton fabric

The effect of flake-like morphology on the coating properties of silver coated copper particles fabricated by electroless plating

Preparation of Nano-Al2O3 Dispersion Strengthened Coating on Copper Surface

Synthesis and Characterization of Silver-Coated Copper Powder Layer

Fabrication of Conductive Copper Patterns Using Photocatalyst-activated Electroless Deposition

In Situ Study of Copper Electrodeposition on A Single Carbon Fiber

Superconformal Copper Electroplating on an Ultrathin Cobalt Seed in an Acidic Copper Sulfate Electrolyte

PREPARATION OF ULTRAFINE W–Cu COMPOSITE POWDER USING ULTRASONIC-ASSISTED ELECTROLESS PLATING