An Embedded Bond-Slip Model for Finite Element Modelling of Soil–nail Interaction

Y. D. Zhou,C. Y. Cheuk,L. G. Tham

DOI: https://doi.org/10.1016/j.compgeo.2009.03.002

IF: 5.218

2009-01-01

Computers and Geotechnics

Abstract:Soil nailing has been widely used as a reinforcing technique to retain excavations and stabilise slopes. Proper assessment of the interaction between the nails and the surrounding soil is central to safe and economical design of the composite reinforced soil structure. In this note, a new interface model, denoted as “embedded bond-slip model”, is proposed to model the soil–nail interaction numerically in a simplified manner. Combining the key features of the embedded element technique and the conventional interface element method, the proposed plane–strain interface model has the advantages that no special considerations have to be given to the arrangement of the finite element mesh for the soil nails, and that possible tangential slippage along the interface can be modelled. The formulation also allows pore water flow across the soil nails to be incorporated into the analysis. The proposed model has been implemented into a finite element code and verified by simple element tests under different uni-direction loading conditions. Using the proposed interface model, back analyses of a field test involving a soil-nailed cut slope subjected to a rise in groundwater table have been conducted. This note presents the details of the embedded bond-slip model and the numerical results which demonstrate that the proposed model is capable of simulating soil–nail interaction conveniently and realistically.