Research on the Machining Process of Monocrystalline Silicon by Electrochemical Discharge Milling

Lü Chuanwei,Gu An,Li Mingyi,Wu Junjie
DOI: https://doi.org/10.3969/j.issn.1009-279X.2013.05.007
2013-01-01
Abstract:A machining method of silicon which is one of the semiconductors in electrochemical discharge milling is proposed.The experiment on machining monocrystalline silicon wafer in electrochemical discharge milling is conducted.The process experiments with different electrical parameters and milling track overlap ratio have been conducted.The effect of two parameters on the surface quality of silicon machined by electrochemical discharge milling is analyzed,The results show that the surface quality decreases with the increase of pulse energy and increases with the increase of the tool path overlap ratio.
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