Abstract:With the continuous development of electronic devices, miniaturization and high capacitance have become important factors in the fabrication of multilayer ceramic capacitors (MLCCs) with a Ni internal electrode (Ni-MLCCs). The typical thickness of the dielectric layer of commercial MLCCs is less than 1 μm, which implies a higher capacitance compared to MLCCs with a thicker dielectric layer. In this study, 1210-type Ni-MLCCs were prepared via a tape casting method using a BaTiO3 powder chemically coated with Dy and Ho additives. The high capacitance (390 nF) Ni-MLCC sintered at 1220 °C exhibited a low dielectric loss (tan δ < 2%), high insulation resistance (>9000 MΩ), and temperature stability comparable to that of the EIA X5R standard (capacitance-temperature coefficient (TCC) = ΔC/C25 °C ≤ ±15%, between -55–85 °C). Relaxation behavior was observed between 1 Hz and 10 kHz, following the modified Curie–Weiss law and the Vogel–Fulcher relationship. The capacitive temperature stability of Ni-MLCC is closely related to the applied direct current (DC) bias field. The EIA X7R stability (TCC ≤ ±15%, between -55–125 °C) of the Ni-MLCCs at 1220 °C was gained under dc-bias field 3 and 5 V/μm. The capacitance varied as alternating current (AC) electric fields were applied. The grain shell was sensitive to both the DC bias and AC fields, but the grain core was more sensitive to the DC bias electrical field than the AC field. Furthermore, the ferroelectric response in MLCC decreases with rising temperature.

Modeling of Dielectric Behaviors of Multilayer Ceramic Capacitors under a Direct Current Bias Field

Evaluation of Residual Stress in a Multilayer Ceramic Capacitor and its Effect on Dielectric Behaviors Under Applied dc Bias Field

Dielectric Behaviour of Batio3-Based Ceramic Multilayer Capacitors under High Dc Bias Field

Influence of Residual Thermal Stresses and Geometric Parameters on Stress and Electric Fields in Multilayer Ceramic Capacitors under Electric Bias

High DC-Bias Stability and Reliability in BaTiO 3 -Based Multilayer Ceramic Capacitors: The Role of the Core-Shell Structure and the Electrode

High DC-Bias Stability and Reliability in BaTiO3-Based Multilayer Ceramic Capacitors: the Role of the Core-Shell Structure and the Electrode

Dielectric Responses of Modified BaTiO3 Ceramics in Multilayer Ceramic Capacitors to the Combined Uniaxial Stress and Dc Bias Field

Effect of Combined External Uniaxial Stress and Dc Bias on the Dielectric Property of Batio3-Based Dielectrics in Multilayer Ceramic Capacitor: Thermodynamics and Experiments

A Three-Dimensional Theoretical Model for Estimating the Thermal Residual Stresses in Micro Multilayer Ceramic Capacitors

Design and FEM Analysis of Multilayer Ceramic Capacitors with Improved Bending and Thermal Shock Crack Performance

Modeling of the Core-Shell Microstructure of Temperature-Stable Batio3 Based Dielectrics for Multilayer Ceramic Capacitors

Influence of Thickness and Number of Dielectric Layers on Residual Stresses in Micromultilayer Ceramic Capacitors

Direct observation of local dielectric conductive paths and their dynamics in the degraded multilayer ceramic capacitors

Boosting Effective Capacitance of Nano-Grained Batio3-Based Ceramics Via a Precise Core-Shell Structure Optimization Strategy

Size Dependence of Residual Thermal Stresses in Micro Multilayer Ceramic Capacitors by Using Finite Element Unit Cell Model Including Strain Gradient Effect

Investigation on the inter-diffusion and microstructure in multilayer ceramic capacitors

Phase-Field Modeling of Electromechanical Breakdown in Multilayer Ceramic Capacitors

Failure model and mechanism of multilayer ceramic capacitor

Simplified Finite Element Model for Thermal Residual Stress in Multilayer Ceramic Capacitors

Effect of Micro Scale on Prediction of Thermal Residual Stresses in Multilayer Ceramic Capacitors (Mlccs)

Preparation of X5R type Ni-MLCCs and capacitance response to combined out-field variations