Abstract:Driven by an ever-growing demand for environmentally benign cooling systems, the past decade has witnessed the booming development in the field of electrocaloric (EC) cooling technology, which is considered as a promising solid-state cooling approach. Multilayer ceramic chip capacitors (MLCCs) represent the optimum structure for EC cooling elements because of large breakdown strengths, low driving voltages, and high macroscopic volumes of active EC materials. However, fundamental relationships between the geometric parameters of MLCCs and the EC coefficient are less understood. In this study, 0.92Pb(Mg1/3Nb2/3)O3-0.08PbTiO3 (PMN–PT) MLCCs with controlled configurations, such as active/inactive layer thickness, number of layers, and active volume ratio, were fabricated, and their EC performance was evaluated. The electric properties of the MLCCs are confirmed to be closely related to the geometric structure, which influences not only the heat flow but also the internal stress, resulting in the variability of EC performance and reliability/breakdown strength. The internal stress arises due to the residual thermal stress originating from the densification-related shrinkage, thermal expansion mismatch during the sintering, and clamping stress arising from the inactive area due to the large strain from the active area under a high electric field. The geometric structure-based stress distribution and the magnitude of stress on the active layers in MLCCs were determined by finite element modeling (FEM) and correlated with the experimental EC coefficients. The results reveal that a low inactive volume percentage is beneficial toward increasing the breakdown field and enhancement of EC performance because of reduced clamping stress on active EC material.This article has not yet been cited by other publications.

Influence of Residual Thermal Stresses and Geometric Parameters on Stress and Electric Fields in Multilayer Ceramic Capacitors under Electric Bias

Evaluation of Residual Stress in a Multilayer Ceramic Capacitor and its Effect on Dielectric Behaviors Under Applied dc Bias Field

Influence of Thickness and Number of Dielectric Layers on Residual Stresses in Micromultilayer Ceramic Capacitors

Effect of Micro Scale on Prediction of Thermal Residual Stresses in Multilayer Ceramic Capacitors (Mlccs)

Size Dependence of Residual Thermal Stresses in Micro Multilayer Ceramic Capacitors by Using Finite Element Unit Cell Model Including Strain Gradient Effect

A Three-Dimensional Theoretical Model for Estimating the Thermal Residual Stresses in Micro Multilayer Ceramic Capacitors

Simplified Finite Element Model for Thermal Residual Stress in Multilayer Ceramic Capacitors

Thermal-Mechanical-Electrical Coupled Design of Multilayer Energy Storage Ceramic Capacitors

Modeling of Dielectric Behaviors of Multilayer Ceramic Capacitors under a Direct Current Bias Field

Design and FEM Analysis of Multilayer Ceramic Capacitors with Improved Bending and Thermal Shock Crack Performance

Effect of Combined External Uniaxial Stress and Dc Bias on the Dielectric Property of Batio3-Based Dielectrics in Multilayer Ceramic Capacitor: Thermodynamics and Experiments

Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress

Finite Element Model for Adhesive Force of Multilayer Ceramic Capacitors and Failure Analysis

Simulation of Mechanical Stresses in BaTiO3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

Dielectric Responses of Modified BaTiO3 Ceramics in Multilayer Ceramic Capacitors to the Combined Uniaxial Stress and Dc Bias Field

Study on cracking failure of MLCC body based on mechanical stress

Dielectric Behaviour of Batio3-Based Ceramic Multilayer Capacitors under High Dc Bias Field

Influence of inner electrode on the microstructure of BZN based MLC

A strategy to detect the effect of electrode defects on the electrical reliability in multilayer ceramic capacitors

Investigation on the inter-diffusion and microstructure in multilayer ceramic capacitors

Phase-Field Modeling of Electromechanical Breakdown in Multilayer Ceramic Capacitors