Simulation of Mechanical Stresses in BaTiO3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

Adam Yuile,Erik Wiss,David Barth,Steffen Wiese

DOI: https://doi.org/10.3390/ma17112702

IF: 3.4

2024-06-04

Materials

Abstract:Multilayer ceramic capacitors (MLCCs) are critical components when thermal processes such as reflow desoldering are used during rework of electronic assemblies. The capacitor's ferroelectric BaTiO3 body is very brittle. Therefore, thermomechanical stresses can cause crack formation and create conductive paths that may short the capacitor. In order to assess the thermally induced mechanical stresses onto an MLCC during reflow desoldering, simulations were carried out, which make use of a framework of computational fluid dynamics and thermomechanical models within the ANSYS software package. In the first step, CFD simulations were conducted to calculate the transient temperature field in the surrounding of the MLCC component, which was then used as an input for FEM simulations to compute the arising mechanical stresses inside the MLCC. The results of the simulations show that the major contribution to mechanical stresses within the MLCC component comes from the mismatch in thermal expansion between the printed circuit board and the MLCC. The temperature gradients along the MLCC component are rather small and account only for moderate internal stresses within the brittle BaTiO3 body.

materials science, multidisciplinary,metallurgy & metallurgical engineering,physics, applied,chemistry, physical, condensed matter

What problem does this paper attempt to address?

The paper attempts to address the issue of simulating the mechanical stress endured by multilayer ceramic capacitors (MLCCs) during reflow desoldering in the rework process of electronic assemblies. Specifically, the paper focuses on the thermomechanical stress caused by the mismatch of the coefficient of thermal expansion (CTE), which can lead to cracks in the MLCCs, thereby affecting their performance or causing failures such as short circuits. By using computational fluid dynamics (CFD) and thermodynamic model frameworks, the researchers aim to evaluate the mechanical stress generated within the MLCCs during reflow desoldering, in order to reduce potential damage risks and optimize temperature control strategies during the rework process.

The research background of the paper includes the demand for precision components such as MLCCs in the manufacturing process of electronic devices, and the challenges these components may face when undergoing thermal treatments (such as reflow desoldering during the rework process). Due to the brittle material properties of MLCCs, they are prone to cracking when subjected to temperature changes, especially in cases where there is a mismatch in the coefficient of thermal expansion with the circuit board. Therefore, understanding and simulating this process is of great significance for improving the reliability of electronic devices and extending their service life.