A Study of the Residual Microstress at the Matrix Interface in Filled Epoxy Resins

HB WANG,SJ LI,HW ZHOU,TY YU,XW JIN

DOI: https://doi.org/10.1002/pen.760321006

1992-01-01

Abstract:Using the technique of photoelasticity, we have studied in detail the magnitude of the residual microstress at the matrix interface between epoxy resin and rubber particles or glass beads. A spheric stress-optic equation applicable to these composites was derived. The photoelastic figures induced by the interfacial residual microstresses and the factors affecting the intensity of light are discussed. The experimental results show that the residual microstresses at the matrix interface are independent of the particle size of rubbers or glass beads, but depend on the nature of fillers, which have different thermal expansion coefficients and mechanical properties. Thermal history and interfacial chemical bonding of filled epoxy resins have distinct effects on the residual interfacial microstresses and the matrix internal stresses.