Abstract:To describe the evolution of residual stresses in epoxy resin during the curing process, a more detailed characterization of its viscoelastic properties is necessary. In this study, we have devised a simplified apparatus for assessing the viscoelastic properties of epoxy resin. This apparatus employs a confining cylinder to restrict the circumferential and radial deformations of the material. Following the application of load by the testing machine, the epoxy resin sample gradually reduces the gap between its surface and the inner wall of the confining cylinder, ultimately achieving full contact and establishing a continuous interface. By recording the circumferential stress–strain on the outer surface of the confining cylinder, we can deduce the variations in material bulk and shear moduli with time. This characterization spans eight temperature points surrounding the glass transition temperature, revealing the bulk and shear relaxation moduli of the epoxy resin. Throughout the experiments, the epoxy resin's viscoelastic response demonstrated a pronounced time-temperature dependency. Below the glass transition temperature, the stress relaxation response progressively accelerated with increasing temperature, while beyond the glass transition temperature, the stress relaxation time underwent a substantial reduction. By applying the time-temperature superposition principle, it is possible to construct the relaxation master curves for the bulk and shear moduli of the epoxy resin. By fitting the data, we can obtain expressions for the constitutive model describing the viscoelastic behavior of the epoxy resin. In order to validate the reliability of the test results, a uniaxial tensile relaxation test was conducted on the epoxy resin casting body. The results show good agreement between the obtained uniaxial relaxation modulus curves and those derived from the bulk and shear relaxation modulus equations, confirming the validity of both the device design and the testing methodology.

On the Thermal-Behavior and Mechanism of Residual Microstress Buildup at the Matrix Interface in Filled Epoxy-Resins

A Study of the Residual Microstress at the Matrix Interface in Filled Epoxy Resins

Interfacial stress concentration and the effect of residual microstress on tensile fracture in filled epoxy resins

Effects of Stress on the Adhesive Behavior of Photoresist

Residual stress and thermal properties of rubber‐modified epoxy systems for semiconductor package

The Effect of Thermal Residual Stress on the Stress State in a Short-Fiber Reinforced Thermoplastic

Study of Heat Treatment Effect on Mechanical Properties of Epoxy Resin Reinforced with Fiber Glass

A Study of the Residual Stress Behavior of Rigid and Flexible Epoxy Adhesives During Thermal Cycle Aging for Electronics Packaging

Effects of Mechanical Stress on Electrical Tree Growth in Epoxy Resin at High Temperature

Anomalous Residual Stress Behavior and Corresponding Dielectric Properties of Epoxy Resin Induced by Physical Aging

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

The mechanisms of elevated temperature property losses in high performance structural epoxy resin matrix materials after exposures to high humidity environments

Internal Stress of Modified Epoxy Resins with Polyester

Effect of Temperature on Environmental Stress Cracking Resistance and Crystal Structure of Polyethylene

Relief of Residual Stress in Bulk Thermosets in the Glassy State by Local Bond Exchange

Chemical, mechanical and morphological investigation on the hygrothermal aging mechanism of a toughened epoxy

Degradation Mechanism for Epoxy Resins under Combined Electric, Thermal and Compressive Stresses

Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation’s Element of a New Electronic Component

Water Absorption and Property Evolution of Epoxy Resin under Hygrothermal Environment

Visualization and Quantification of the Stress Distribution on Epoxy Resin Through Photoelasticity and Infrared Radiation Techniques

Thermal Treatment Effects on Structure and Mechanical Properties of Polybutylene Terephthalate and Epoxy Resin Composites Reinforced with Glass Fiber