Abstract:Gyroscopes are one of the next killer applications for the MEMS (Micro-Electro-Mechanical-Systems) sensors industry. Many mature applications have already been developed and produced in limited volumes for the automotive, consumer, industrial, medical, and military markets. Plenty of high-volume applications, over 100 million per year, have been calling for low-cost gyroscopes. Bulk silicon is a promising candidate for low-cost gyroscopes due to its large scale availability and maturity of its manufacturing industry. Nevertheless, it is not suitable for a real monolithic IC integration and requires a dedicated packaging. New designs are supposed to eliminate the need for magnets and metal case package, and allow for a real monolithic MEMS-IC (Integrated Circuit) electronic system. In addition, a drastic cost reduction could be achieved by utilizing off-the-shelf plastic packaging with lead frames for the final assembly. The present paper puts forward the design of a novel tri-axial gyroscope based on rotating comb-drives acting as both capacitive sensors and actuators. The comb-drives are comprised of a single monolithic moving component (rotor) and fixed parts (stators). The former is made out of different concentrated masses connected by curved silicon beams in order to decouple the motion signals. The sensor was devised to be fabricated through the PolyMUMPs® process and it is intended for working in air in order to semplify the MEMS-IC monolithic integration.

Micro device array design and fabrication in monolithic MEMS SoC.

Microdevice Array Design and Fabrication in Monolithic MEMS SoC

Monolithic Mems Soc Design And Fabrication Using 0.35 Mu M Bcd Technology

Design of Freeform Geometries in a MEMS Accelerometer with a Mechanical Motion Preamplifier Based on a Genetic Algorithm

Monolithic Integrated Micro-Opto-Electromechanical Accelerometer Based on Michelson Interferometer Structure

Post-CMOS Processing for High-Aspect-Ratio

Micromachining of Multi-Thickness Sensor-Array Structures with Dual-Stage Etching Technology

A Novel Fabrication Methodology for Micromachined Sensor-Arrays with Multi-Thickness Configuration

Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

Patterned Microstructure Array Fabrication By Using A Novel Standing Surface Acoustic Wave Device

Three-dimensional integration of suspended single-crystalline silicon MEMS arrays with CMOS

Study on Compatible Cmos-Mems Process with Surface Micromachining for the Application of Monolithic Integration

Design of a Tri-Axial Surface Micromachined MEMS Vibrating Gyroscope

Design of the Monolithic Integrated Array MEMS Hydrophone

Realization of Three-Dimensionally MEMS Stacked Comb Structures for Microactuators Using Low-Temperature Multi-Wafer Bonding with Self-Alignment Techniques in CMOS-Compatible Processes

A CMOS Compatible Process for Monolithic Integration of High-Aspect-ratio Bulk Silicon Microstructures

A Flip-Chip Assembled Microplatform For Hybrid Mems

Design and fabrication of novel three-dimensional multi-electrode array using SOI wafer

A Three-Axis CMOS-MEMS Accelerometer Structure With Vertically Integrated Fully Differential Sensing Electrodes