Numerical Simulation of Thermally Induced Stress and Warpage in Injection-Molded Thermoplastics

YX Gu,HM Li,CY Shen
DOI: https://doi.org/10.1002/1098-2329(200121)20:1<14::aid-adv1001>3.3.co;2-j
IF: 2.5022
2001-01-01
Advances in Polymer Technology
Abstract:Thermally induced stress and the relevant warpage cause by inappropriate mold design and processing conditions are problems that confounded the overall success of injection molding.A thermorheologically simple thermoviscoelastic two-dimension material model is used to simulate the residual stress and warpage within injection molded parts generated during the cooling stage of the injection molding cycle.The initial temperature field corresponds to the end of the filling stage.The fully time-dependent algorithm is based on the calculation of the elastic response at every time step.Numerical results are discussed with respect to temperature and pressure.
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