Abstract:A multilayer routing system usually adopts multiple interconnect configuration with different wire sizes and thicknesses. Since thicker layers of metal lead to fatter wires with smaller resistance, the layer assignment (LA) of nets has a large impact on the interconnect delay. However, such layer-dependent characteristics have been ignored by most of the state-of-the-art academic LA methods. These characteristics also weaken the previous wire length-based antenna avoidance method, because the net length itself cannot accurately capture the antenna area under the condition of various wire sizes. To remedy this deficiency, this paper proposes a more effective three-stage LA algorithm under multitier interconnect structure, and focuses on minimizing delays, via count, and antenna violations. It first minimizes the total delay and via count simultaneously by dynamic programming and negotiation technique, and then further minimizes the maximum delay carefully while almost unchanging the via count. After that, a check-and-repair method is adopted to further fix the antenna violations. The experimental results on the International Conference on Computer-Aided Design'09 benchmarks show that the proposed algorithm can significantly reduce the total delay and maximum delay while still keeping roughly the same via count compared with the state-of-the-art via count minimization LA method negotiation-based via minimization algorithm. At the same time, the antenna violation repair method can dramatically reduce the antenna violated nets and sinks with little impact on the solution quality.

Timing Driven Layer Assignment Considering Via Resistance and Coupling Capacitance

Timing-Aware Layer Assignment for Advanced Process Technologies Considering Via Pillars

MiniDelay: Multi-Strategy Timing-Aware Layer Assignment for Advanced Technology Nodes

A New Via Chain Design Method Considering Confidence Level and Estimation Precision

A New Timing-Driven Placement Algorithm Based on Table-Lookup Delay Model

PDN Impedance Modeling for Multiple Through Vias Array in Doped Silicon

Crosstalk and Congestion Driven Layer Assignment Algorithm

Delay-Driven and Antenna-Aware Layer Assignment in Global Routing under Multitier Interconnect Structure

Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures

Timing-Driven Placement via Preassigning Cell

Post-routing Layer Assignment for Double Patterning with Timing Critical Paths Consideration

Path-based timing optimization by buffer insertion with accurate delay model

Redundant Vias Insertion for Performance Enhancement in 3D ICs.

Via assignment algorithm for hierarchical 3-D placement

Simultaneous Buffer and Interlayer Via Planning for 3D Floorplanning

Integrated Interlayer Via Planning And Pin Assignment For 3d Ics

A Coupling and Crosstalk Considered Timing-Driven Global Routing Algorithm for High Performance Circuit Design

Layer Assignment Algorithm For Rlc Crosstalk Minimization

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards with Vias and Decoupling Capacitors

Eliminating Timing Errors Through Collaborative Design to Maximize the Throughput

Vertical Via Design Techniques for Multi-Layered P/G Networks