Abstract:An accurate temperature analysis of electronic packaging requires an understanding of the thermal-transport parameters of the material. However, studies on the thermal conductivity of intermetallic compounds (IMCs) in micro-interconnect solder joints are scarce, particularly common IMCs forming in Cu-Sn systems, which seriously affect the precise prediction of the temperature field and thermal stress for electronic packaging structures. This work proposes a novel method to quantitatively measure the thermophysical parameters of Cu-Sn IMCs based on the dual-wavelength femtosecond laser timedomain thermoreflectance (TDTR) system. Cu-Sn diffusion couple samples were prepared using a reflow and aging process. Two layers of Cu6Sn5 and Cu3Sn IMCs formed at the interface with micron thickness, and the (001) crystal plane of Cu6Sn5 was the preferred orientation. The sensitivity of the experimental parameters to the measurement parameters affects the fitting accuracy. Therefore, before testing, the effects of the aluminum transducer thickness and pump laser modulation frequency on the phase signal sensitivity in the thermal conductivity measurements of Cu6Sn5 and Cu3Sn were analyzed to help select the specific experimental parameters. After testing, the thermal conductivities of Cu6Sn5 and Cu3Sn were 47.4 and 87.6 W/(m center dot K), respectively, which are slightly higher than the previous results because of the microstructure discrepancy caused by different material preparation techniques. Finally, the influence of the pump laser diameter, aluminum transducer thickness, and material specific heat on the measurement error of thermal conductivity for Cu6Sn5 and Cu3Sn was examined. The test errors of the Cu6Sn5 and Cu3Sn thermal conductivity were -6.8%similar to 4.6% and -7.1%similar to 4.4%, respectively. Overall, the TDTR technology can evaluate the thermal-transport characteristics of micron-scale intermetallic compounds in electronic packaging and guide the thermal design and reliability evaluations of electronic components.

Measurement of Thermal Boundary Conductance Between Metal and Dielectric Materials Using Femtosecond Laser Transient Thermoreflectance Technique

Measurements of electron-phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique

Thermal Conductance of Metal-Metal Interfaces

Prediction and Measurement of Thermal Transport Across Interfaces Between Semiconductor and Adjacent Layers

Nano-metal film thermal conductivity measurement by using the femtosecond laser pump and probe method

Simultaneous measurement of cross-plane thermal conductivity and interfacial thermal conductance of nano-metal films on a low thermal diffusivity substrate using TDTR

Measurement of the Thermal Transport Properties of Dielectric Thin Films Using the Micro-Raman Method

Thermal Conductance of Interfaces with Amorphous SiO2 Measured by Time-Resolved Magneto-Optic Kerr-effect Thermometry

Ultrafast Thermoreflectance Techniques for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films

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Electronic interfacial thermal conductance between metal nano-films in sub-picosecond non-equilibrium transport process

Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System

The Effect of Enhanced Heat Transfer Across Metal-Nonmetal Interfaces Subject to Femtosecond Laser Irradiation

Ultrafast laser measurement of thermal diffusivity of thin dielectric films

Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance

Measurement of the Thermal Wave in Metal Films Using Femtosecond Laser Thermoreflectance System

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Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance

Thermal Conductivity Measurement of Submicron-Thick Aluminium Oxide Thin Films by A Transient Thermo-Reflectance Technique

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Measurement of Thermal Energy Coupling to Metallic Materials in Millisecond Laser Based on Optical Diffraction