Abstract:Using the complex image method (CIM), we have analyzed the frequency and temperature dependencies of substrate eddy currents for single-ended and differential spiral inductors on a lossy silicon substrate. From our analysis, we have derived a set of accurate closed-form expressions for calculating inductances and substrate losses due to substrate eddy currents. Here, we propose a frequency-dependent eleven-element equivalent circuit model based on these formulas. We established the validity of the model by comparing the simulated and measured results, which are in good agreement. Index Terms—Complex image method (CIM), differential inductor, eddy currents, greenhouse algorithm, inductor model. HE high operating frequencies, at which deep submicrom- eter and nano-scale CMOS devices are able to operate, have brought radio-frequency integrated circuits (RFICs) in the realm of CMOS making the quality factor of the on-chip spiral inductors a focus of intense research. The quality factor of the on-chip inductor is limited by the losses due to the finite conduc- tivity of the metal and the conducting silicon substrate. Non-per- fect metal wires used to form spiral inductors cause ohmic loss due to the non-zero resistance at low frequencies. Additionally the non-uniform current distribution in metal wires at high fre- quencies increases the losses and degrades the quality factor of inductors. This loss mechanism has been extensively studied as skin- and proximity-effect (1)-(12).

Enhancement of Broadband Performance for On‐chip Spiral Inductors with Inner‐patterned‐ground

The enhancement of Q factor for patterned ground shield inductors at high temperatures

PERFORMANCE TRENDS OF ON-CHIP SPIRAL INDUCTORS FOR RFICS

Global Performance Evaluation of Various On-Chip Square Spiral Inductors on Gaas Substrates

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Model Description and Parameter Extraction of On-Chip Spiral Inductors for MMICs

Electrical Characteristics and Behavioral Model of Spiral Inductors On Gaas Substrate

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

Double-level Spiral Inductors with Multiple-Via Interconnects on GaAs Substrates

A Study of On-Chip Stacked Multiloop Spiral Inductors

On-chip EMC issue: the implementation of patterned ground shields for silicon devices

A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors

Experimental Characterisation Of On-Chip Octagonal Double-Helix Inductors On Silicon Substrates

An improved equivalent circuit model for predicting the transmission characteristics of spiral inductors on GaAs substrates

Novel On-Chip Spiral Inductors with Back Hollow Structure

Analysis of Frequency- and Temperature-Dependent Substrate Eddy Currents in On-Chip Spiral Inductors Using the Complex Image Method

Vertical Topologies of Miniature Multispiral Stacked Inductors

Transfer Function Analysis and Broadband Scalable Model for On-Chip Spiral Inductors

Modeling and Simulation of Spiral Inductors in Wafer Level Packaged RF/Wireless Chips

Accurate Model for Micromachined Microwave Planar Spiral Inductors

Design and Fabrication of the Suspended High-Q Spiral Inductors with X-Beams