Physical Origin of Hydrogen-Adsorption-induced Metallization of the SiC Surface: N-Type Doping Via Formation of Hydrogen Bridge Bond.

H Chang,J Wu,BL Gu,F Liu,WH Duan
DOI: https://doi.org/10.1103/physrevlett.95.196803
IF: 8.6
2005-01-01
Physical Review Letters
Abstract:We perform first-principles calculations to explore the physical origin of hydrogen-induced semiconductor surface metallization observed in beta-SiC(001)-3 x 2 surface. We show that the surface metallization arises from a novel mechanism of n-type doping of surface band via formation of hydrogen bridge bonds (i.e., Si-H-Si complex). The hydrogen strengthens the weak Si-Si dimers in the subsurface by forming hydrogen bridge bonds, and donates electron to the surface conduction band.
What problem does this paper attempt to address?