Abstract:With the current explosive growth of communication technologies and a wide variety of applications being found for broadband and high frequency of electronic components, LTCC (Low Temperature Cofired Ceramics and Ferrites) with materials that possess special characteristics have been rapidly developed, due to its greater multifunctionality, higher performances, sub-miniaturization and excellent reliability. As one of the most important passive components, the chip inductor with high inductances used in high frequency has attracted significant interests in 3-D miniaturized systems. This paper focuses on the design and fabrication of a chip inductor based on the ZnTi-substituted hexaferrite BaFe12O19 by LTCC technology to realize the 0805 size of standard packaging for high frequency applications. Testing results show that the value of inductor is 2.45uH and cut-off frequency is 548MHz. And the measured results agree with the simulated data basically, which indicates that the samples can satisfy the need of high frequency inductors. The influences of each factor on the performances of inductor are also analyzed. It is an effective method to resolve the consistency problems between simulation and manufacture.

Laminated LTCC low-pass filter with cut-off frequency of 200MHz

Design of multilayer triangular substrate integrated waveguide filter in LTCC

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Design of X-band Hi-Lo Microstrip Low-pass Filters

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FDTD modeling of 3D metal-LTCC structures for RF(MM)ICs

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Design of a RF MEMS Passive LC Filter

Design of band-pass filter on different materials in LTCC/LTCF technology

Simulation Optimizing and Preparation of LTCC Multilayer Bandpass Filter

Compact Dual‐layer Substrate‐integrated Waveguide Bandpass Filters with Controllable Transmission Zeros

Design of Compact LC Lowpass Filters Based on Coaxial Through-Silicon Vias Array

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Ultra-Low-Loss Millimeter-Wave LTCC Bandpass Filters Based on Flexible Design of Lumped and Distributed Circuits.

A Miniaturized C-B and SIW Bandpass Filter based on LTCC

Realization Of An Integrated Planar Lc Low-Pass Filter With Modified Surface Micromachining Technology