Source and characteristics of inorganic acidic gases and aerosols emission in a semiconductor plant
Jyun-Lun Peng,Ming-Peng Yeh,Kuan-Hung Liu,Tony Chen,Tzu-Sou Chuang,Sher Ling Lee,Kuo-Lun Tung
DOI: https://doi.org/10.1016/j.seppur.2024.128806
IF: 8.6
2024-07-20
Separation and Purification Technology
Abstract:Inorganic acids, widely used in semiconductor manufacturing processes, have become a concern as improper handling of these acids can have severe environmental impacts. This study investigates the major contamination source of inorganic acids (hydrofluoric acid, hydrochloric acid, nitric acid, phosphoric acid, and sulfuric acid), the different ratios of solid and gaseous inorganic acids, and the particle size distribution of solid particles emitted after local scrubber (LSC) treatment. An assessment of pollutant status revealed that hydrofluoric acid emissions dominate in the chemical vapor deposition (CVD) process at 65%, hydrochloric acid in the diffusion (DIFF) process at 69%, phosphoric acid in the epitaxy (EPI) process at 100%, and sulfuric acid in wet etching at 85%. In contrast, particulate matter constitutes the primary component, ranging from 82% to 99% of the LSC emission. The LSC configuration is then adjusted based on the overview of inorganic acid emissions from different processes to match their characteristics. After related improvement activities, the results presented a significant reduction of 56% to 87% in inorganic acid emissions at the outlet of the LSC, and 18-68% reduction in the stack emissions.
engineering, chemical