Reduction of Crystallization Temperature of the Nd–Fe–B Thin Films by Cu Addition

YG Ma,Z Yang,M Matsumoto,A Morisako,S Takei
DOI: https://doi.org/10.1016/j.mseb.2004.03.015
2004-01-01
Abstract:Nonmagnetic Cu element has been doped into the sputtered Nd–Fe–B thin films. It is found that the introduction of suitable amount of copper atoms could reduce the crystallization temperature of the 2:14:1 phase by near 100 °C, compared with that without Cu. For the 15 nm Nd16Fe70.2Cu1.8B12 film deposited at 340 °C, perpendicular coercivity and remanent magnetization ratio of 350 kA/m and 0.96 have been successfully obtained. Cu addition would lead to the grain growth, but the average grain size in the films could be greatly decreased through lowering the deposition temperature. These results are compared with those found in the fabrication of FePtCu films.
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