Effect of Interfacial Diffusion on Microstructure and Magnetic Properties of Cu∕FePt Bilayer Thin Films

SK Chen,FT Yuan,TS Chin
DOI: https://doi.org/10.1063/1.1870110
IF: 2.877
2005-01-01
Journal of Applied Physics
Abstract:The crystal structure, microstructure, and magnetic properties for a series of Cu∕FePt bilayer films were investigated. The samples were prepared by depositing a Cu top layer on a highly ordered L10 FePt film. To promote interdiffusion, the bilayer samples were annealed at a temperature Td ranging from 300to800°C. X-ray diffraction data indicate that observable diffusion occurs at 400°C. The maximum coercivity thus obtained is 14.0kOe, which is 24% larger than that of the ordered FePt film without a Cu top layer. The high Hc can be attributed to the diffusion of copper atoms through the grain boundaries of the magnetic films, which may produce extra pinning sites for domain-wall movement. The ΔM data measured from the Henkel plots of annealed Cu∕FePt films change from negative to positive values as Td is raised from 400to800°C. This can result from the effects of demagnetization coupling and exchange coupling and is further explained from the variation of squareness ratios of hysteresis loops.
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