Abstract:Gate oxide breakdown (OBD) is a key factor limiting the useful lifetime of an integrated circuit. Unfortunately, the conventional approach for full chip OBD reliability analysis assumes a uniform oxide thickness and worst-case temperature for all devices. In practice, however, gate oxide thickness varies from die-to-die and within-die and hence may cause different reliability for different devices even chips. Moreover, due to the increased across-die temperature variation, such difference may be exacerbated. Thus, as the precision of variation control worsens, an alternative reliability analysis approach is needed. In this paper, we propose a statistical framework for chip-level gate OBD reliability analysis while considering both die-to-die and within-die components of thickness variations as well as the across-die temperature variation. The thickness of each device is modeled as a distinct random variable and thus the full chip reliability estimation problem is defined on a huge sample space of several million devices. We observe that the chip-level OBD reliability function is independent of the relative location of the individual devices. This enables us to transform the problem such that the resulting representation can be expressed in terms of much fewer random variables. Using this transformation, we present a computationally efficient and accurate approach for estimating the full chip reliability while considering spatial correlations of gate oxide thickness as well as temperature variation. We show that, compared to Monte Carlo simulation, the proposed method incurs an error of only around 1% while improving the runtime by more than three orders of magnitude.

An Efficient Method for Evaluating Analog Circuit Performance Bounds Under Process Variations.

Analog Circuits Performance Variation Analysis under Process Variations

Time-Domain Performance Bound Analysis of Analog Circuits Considering Process Variations

A novel approach to estimate the impact of analog circuit performance based on the small signal model under process variations

Performance bound analysis of analog circuits considering process variations

Variation-aware gate sizing and clustering for post-silicon optimized circuits.

Design Time Body Bias Selection for Parametric Yield Improvement.

Performance Bound and Yield Analysis for Analog Circuits under Process Variations.

Process Variation and Temperature-Aware Full Chip Oxide Breakdown Reliability Analysis.

Time-domain performance bound analysis for analog and interconnect circuits considering process variations

Performance Robustness Analysis of VLSI Circuits with Process Variations Based on Kharitonov's Theorem

Worst case analysis for evaluating VLSI circuit performance bounds using an optimization method.

Modelling Circuit Performance Variations Due to Statistical Variability: Monte Carlo Static Timing Analysis

Improving the Process-Variation Tolerance of Digital Circuits Using Gate Sizing and Statistical Techniques

A Study of Statistical Variability-Aware Methods

Efficient and Accurate Statistical Analog Yield Optimization and Variation-Aware Circuit Sizing Based on Computational Intelligence Techniques

Analog circuit performance bound estimation based on extreme value theory

Circuit Optimization over Multiple Process Corners for Analog Electronic Design Automation.

Microarchitecture Parameter Selection to Optimize System Performance under Process Variation

Worst Case Analysis of Linear Analog Circuit Performance Based on Kharitonov's Rectangle

Efficient Approach for Monte Carlo Simulation Experiments and Its Applications to Circuit Systems Design