INTERFACIAL EFFECTS OF FATIGUE CRACKING IN METALLIC MATERIALS

ZHANG Zhefeng,ZHANG Peng,TIAN Yanzhong,ZHANG Qingke,QU Shen,ZOU Hefei,DUAN Qiqiang,LI Shouxin,WANG Zhongguang
DOI: https://doi.org/10.3321/j.issn:0412-1961.2009.07.003
IF: 1.797
2009-01-01
ACTA METALLURGICA SINICA
Abstract:Interfacial fatigue cracking behaviors along large-angle grain boundaries(GBs),twin boundaries(TBs),phase boundaries(PBs) and joint interfaces in metallic materials were summarized. It is found that the resistance to fatigue crack initiation decreases in the order of low-angle GBs, persistent slip bands and the large-angle GBs in pure Cu.For annealing TBs,fatigue cracking initiation strongly depends on the stacking fault energy(SFE) in Cu alloys.With decreasing SFE,fatigue cracking along TBs becomes easy.In Cu-Ag binary alloys,the misorientation across GBs or PBs plays an important role in the fatigue cracking,and large misorientation often makes the final fatigue cracking.For the Cu/solder joint interface,the interfacial fatigue cracking modes are affected by the solders and aging time.In Sn-Ag/Cu solder joints,fatigue crack normally nucleates along the interface between the Sn-Ag solder and the intermetallics compounds(IMCs);however,for Sn-Bi/Cu solder joints,brittle interfacial fatigue cracking always occurs along the interface between Cu and the IMCs due to the Bi segregation after aging for a long time.
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