Abstract:Thermal management systems are crucial for ensuring the reliable operation of electronic devices. Heat dissipation using phase change materials (PCMs) is an effective, lightweight method for devices experiencing transient high heat flow. Graphite foam(GF), known for its high thermal conductivity and low density, significantly increases thermal conductivity when combined with PCMs. However, research on the heat transfer characteristics of composite PCMs is limited. This study experimentally investigates the heat dissipation characteristics of a graphite foam-PCM (GF-PCM) composite cooling structure. It explores the impact of factors like the shell's tilt angle, acceleration, and the position of cavities (voids) between the PCM and the shell structure on the transient melting heat transfer of the cooling device under varying thermal source heat flux densities. Results show that using a pure paraffin phase change module, the temperature rise of the heat source increases with the tilt angle, and horizontal placement offers the best heat dissipation and temperature control. The position of the cavity influences heat dissipation; at 30W heating power, a cavity between the heat source and paraffin increases the temperature rise of the heat source by 19.2%. Furthermore, cavity position is affected by acceleration; at 50W heating power and 3.6g acceleration, the cavity shifts from the top of the module to near the heat source side, increasing its final temperature by 3.7°C. Acceleration also enhances liquid paraffin convection, significantly affecting paraffin's later melting stage. Adding graphite foam speeds up paraffin melting, reducing the temperature rise of the heat source by 42.8%, 42.9%, and 28.3% at 30W, 40W, and 50W heating powers, respectively. This improvement mitigates the adverse effects of tilt angle, cavities, and uncertainties introduced by acceleration.

Investigation on Application of Phase Change Thermal Control in Electronic Devices

Application of Phase-Change Thermal Control in Heat Shock Resistance of Electronic Devices

Thermophysical Properties of Paraffin-Based Composite Phase Change Materials Filled with Carbon Nanotubes

Performance of Temperature-Controlled Electronic Heat Sink with Composite Paraffin/Expanded Graphite Phase Change Material

Experimental study of novel paraffin-fatty acid eutectic mixtures for thermal management of electronic devices

Thermally conductive composite phase change materials with excellent thermal management capability for electronic devices

Influence of Physical Parameters of Phase-change Film on Thermal Control of Electronic Devices

Performances of a Thermal Management System Using Different Phase Change Materials on a Simulative Electronic Chip

Investigation on the Melting Performance of a Phase Change Material Based on a Shell-and-Tube Thermal Energy Storage Unit with a Rectangular Fin Configuration

Experimental Study on the Temperature Control Characteristics of Graphite Foam-Based Composite Phase Change Materials

Cooling Technology of Electronic Device Based on Phase-Change Material with Rapid Thermal Response

Experimental and numerical study on thermal performance of Wood's alloy/expanded graphite composite phase change material for temperature control of electronic devices

Studies on Thermal Properties and Thermal Control Effectiveness of a New Shape-Stabilized Phase Change Material with High Thermal Conductivity

Numerical and experimental study on the heat transfer properties of the composite paraffin/expanded graphite phase change material

Experimental Study on Pressure-Enhanced Close Contact Melting with PCMs for Stable Temperature Control of High Heat Flux Electronic Devices

Research Progress in Thermal Control Phase Change Materials and Composites Preparation

Experimental Research on Melting Heat Storage of Paraffin

Numerical Study on Thermal Characteristics of a Micro-Encapsulated Phase Change Composite Plate

The Regulation Mechanism and Heat Transfer Enhancement of Composite Mixed Paraffin and Copper Foam Phase Change Materials

Heat Transfer of Heat Sink Encapsulated with Phase Change Material to Prevent Temperature from Rising for Electronic Devices

Hierarchically Encapsulated Phase-Change Film with Multi-stage Heat Management Properties and Conformable Self-Interfacing Contacts for Enhanced Interface Heat Dissipation