Abstract:In modern microprocessor and SoC designs, supply noise margin has been significantly reduced due to the continuously decreasing supply voltage level. On the other hand, with increasing current density, chips may see larger supply noise variations on various spots and from time to time. As a result, chip robustness and reliability are inevitably deteriorated with more frequent supply noise emergencies. It is therefore crucial to have an efficient supply noise prediction method to enhance design robustness. The state-of-art solutions either try to build a spatial noise estimation framework at the layout-level using the limited distributed physical noise sensors or attempt to develop emergency predictors at the architecture-level thus ignore back-end power delivery details In this paper, we propose a cross-layer framework for temporal supply noise prediction. Our method not only accounts for the temporal characteristics of workload execution at micro-architecture-level but also incorporates the power delivery model at the circuit-level into such system-level prediction. In order to enable the capability of on-the-fly noise prediction, we first bridge the gap between system-level workload and micro-architectural-level power by employing an OLS-based power estimation model and an adaptive ARIMA-based power prediction model. Then a layout-level supply noise model is developed to explore the correlations between micro-architectural-level power and layout-level supply noise. Compared with existing methods, the proposed ARIMA-based power model improves the prediction performance by up to 37.5%/63.0% in X86/ARM. Moreover, compared with SPICE simulation, our framework is able to estimate present supply noise with an average error of 0.005% and predict future supply noise with an average error of 1.58%/1.17% for X86/ARM architecture.

Temperature-Aware Leakage Estimation Using Piecewise Linear Power Models

Accurate Temperature-Dependent Integrated Circuit Leakage Power Estimation is Easy

Is Leakage Power a Linear Function of Temperature?

Statistical Modeling and Analysis of Chip-Level Leakage Power by Spectral Stochastic Method

Run-time Demand Estimation and Modulation of On-Chip Decaps at System Level for Leakage Power Reduction in Multicore Chips

A Simplification Method for Power Device Thermal Modeling with Quantitative Error Analysis

A Cross-Layer Framework for Temporal Power and Supply Noise Prediction

Thermal Effects with Leakage Power Considered in 2D/3D Floorplanning

Temperature-dependent Optimization of Cache Leakage Power Dissipation

A Thermal-Conscious Integrated Circuit Power Model and Its Impact on Dynamic Voltage Scaling Techniques

Efficient Full-Chip Statistical Leakage Analysis Based on Fast Matrix Vector Product.

An Efficient Leakage-Aware Thermal Simulation Approach for 3D-Ics Using Corrected Linearized Model and Algebraic Multigrid.

Full-Chip Leakage Analysis for 65 Nm Cmos Technology and Beyond

Thermal effects of leakage power in 3D ICs

The Heat Conduction Model and Leakage Characterization of the Sealing Interface

Statistical analysis of full-chip leakage power for 65nm CMOS node and beyond

A Leakage Power Estimation Method for Standard Cell Based Design

Accurate and Fast Estimation of Junction Band-to-Band Leakage in Nanometer-Scale MOSFET

Full-Chip Leakage Analysis In Nano-Scale Technologies: Mechanisms, Variation Sources, And Verification

Comprehensive Thermal Resistance Model of Forced Air Cooling System for Multiple Power Chips

Statistical Analysis of Full-Chip Leakage Power Considering Junction Tunneling Leakage