Abstract:Silver (Ag) has widespread application potential in the field of non-silicon microelectromechanical systems (MEMS) due to its superior material properties. However, the current Ag-based prototyping technologies are mainly limited by harsh production conditions and poor compatibility with multiple processes. In this work, we present an Ag-based 3D electrodeposition manufacturing relies on synergistic nucleation mechanism, which combines UV-LIGA technology and bottom-up Ag electroplating. Based on the optimized Ag electroplating system, the synergistic nucleation mechanism of Ag is comprehensively investigated through the interplay between electrochemistry and microstructure. During the bottom-up filling process, the nucleation mode gradually transforms from instantaneous to progressive, which corresponds to the transition of Ag crystallization from large grains dominated by (220) crystal face to fine grains controlled by (111) orientation. And the Young's modulus and hardness are increased to 5.5% and 37.8%, respectively. Moreover, the forming capability and application potential of the proposed Ag electrodeposition technique are demonstrated, where the maximum aspect ratio is up to 10. The Ag-based heat sink is fabricated as a proof-of-concept by heterogeneously integrating Ag microchannels with an AlN heat source. It exhibits excellent mechanical stability (tau = 73 MPa, sigma 0.2 = 257 MPa) and cooling performance approaching 1000 W/cm2. The proposed Ag-based 3D electrochemical deposition technology has controllable processes, multi-integration compatibility, and excellent performance, indicating a broad application prospect in MEMS devices.

Electroplating Silver Tetracyanoquinodimethane Between Gold Micro-Gap Electrodes for the Fabrication of Coplanar Devices, a New Way to Integrate Material Synthesis and Devices Fabrication Within One Step

Silver-Tetracyanoquinodimethane (Ag-Tcnq) Nanostructures And Nanodevice

Electrochemical Fabrication of Gold Electrode Pairs with Nanoscale Gap

Fabrication of Free-Standing Nanoporous Silver by Selectively Dissolving Gold from Gold–silver Alloys Via a Novel Converse Dealloying Method

Controllably Constructing Gold Nanostructures on Electrodes Through Growth of Zinc Oxide Nanorods and Two-Step Electroplating

Non-Cyanide Thick Silver Electrodeposition Base on Instantaneous Nucleation for 3D Microstructures with High Performance

Electrochemical Synthesis of Silver-Tetracyanoquinodimethane Nanorods at Agar Supported Water/1,2-Dichloroethane Interface

Electrochemical Synthesis of High-Quality AgTCNQ Nanowires Using Carbon Nanotube Electrodes

Chemical fabrication of heterometallic nanogaps for molecular transport junctions.

Synthesis of gold nano/micro wire by templateless AC electro-deposition

Electrochemical Approach for Fabricating Nanogap Electrodes with Well Controllable Separation

Effect of Synergistic Nucleation on Microstructural and Mechanical Characteristics of Silver Micro-Devices with High Aspect Ratio

Underpotential And Overpotential Electrocrystallization Of Semiconducting Silver-Tetracyanoquinodimethane Onto Gold Substrates From An Ionic Liquid

Controllable Template Synthesis of Ni/Cu Nanocable and Ni Nanotube Arrays: a One-Step Coelectrodeposition and Electrochemical Etching Method.

Fabrication of nanometer-spaced electrodes using gold nanoparticles

Metal nanoparticle wires formed by an integrated nanomolding-chemical assembly process: fabrication and properties.

Real Time and in Situ Control of the Gap Size of Nanoelectrodes for Molecular Devices

Tri-layer nanoporous silver | gold | silver by etching without sacrificing materials through the Kirkendall effect

Electrically driven cation exchange for in situ fabrication of individual nanostructures

Fabrication of A Nano-Scale Gap by Selective Chemical Deposition

Direct Synthesis of Au-Ag Nanoframes by Galvanic Replacement via a Continuous Concaving Process