Thermodynamic Behavior of Copper-Coated Silicon Carbide Particles during Conventional Heating and Spark Plasma Sintering

Rui Zhang,Lian Gao,Jingkun Guo
DOI: https://doi.org/10.1111/j.1151-2916.2003.tb03494.x
IF: 4.186
2003-01-01
Journal of the American Ceramic Society
Abstract:75Cu.25SiC (vol%) compacts were prepared using copper-coated SiC particles and spark plasma sintering (SPS). The preliminary thermal performance of the coated particles was determined using simultaneous DSC-TG-MS measurement. Characterization of compacts using XRD and SEM techniques was conducted to investigate the physical and chemical changes during the SPS operation. It was found that CuO decomposed at 850degrees and 500degreesC during conventional heating and SPS, respectively. Cu2O facilitated the densification of Cu/SiC composites. The optimized sintering temperature of Cu/SiC composites using SPS was similar to730degreesC. The compacts showed improved hardness because of the SiC reinforcement.
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