Experimental Study of an Integrated Aluminum Flat Plate Heat Pipe for Lightweight Thermal Management in Electronic Devices
Jingjing Bai,Yiming Li,Yincai Zhao,Fangqiong Luo,Tong Sun,Yifu Liang,Yong Tang,Shiwei Zhang
DOI: https://doi.org/10.1016/j.applthermaleng.2024.124332
IF: 6.4
2024-01-01
Applied Thermal Engineering
Abstract:Aluminum flat plate heat pipes have attracted much attention in mobile devices and high-performance computing due to their lightweight and cost-effectiveness. However, traditional aluminum flat heat pipes have performance bottlenecks in high heat flux dissipation. In this study, an integrated aluminum flat plate heat pipe featuring a 3D spirally woven mesh wick coated with aluminum powder was proposed. The wick was roughened and securely bonded to the aluminum shell via a powder bonded tape casting process, significantly enhancing the capillary performance and heat flux dissipation capability of the heat pipe. The effects of the filling ratio and operational angles on the heat transfer performance of these heat pipes with acetone as the working medium were investigated. At a 40 % filling ratio and 90(degrees) gravitational assistance, the critical heat flux of the heat pipe was achieved as 31.82 W/cm(2), with a total thermal resistance of 0.0521 C-degrees/W, and an equivalent thermal conductivity of 14545.27 W/(m center dot K) was determined, values that are high relative to current research. This study breaks through the high heat flux dissipation performance bottleneck of traditional aluminum flat plate heat pipes, providing a novel reference for enhancing the heat transfer performance of aluminum-based heat pipes with wick structures.