Extended 0.13 Μm CMOS Technology for the Ultra High-Speed and MS/RF Application Segments
CS Chang,CP Chao,YK Leung,CH Lin,HM Hsu,YP Wang,SY Chang,TH Chiu,JS Shyu,CC Wu,CH Wang,RY Chang,CW Chen,CF Huang,CH Chen,SH Chen,TH Yeh,JY Cheng,JJ Liaw,YL Chu,TC Ong,MC Yu,CH Yu,IJ Lin,HJ Tao,MS Liang,YC See,CH Diaz,YC Sun
DOI: https://doi.org/10.1109/vlsit.2002.1015391
2002-01-01
Abstract:This paper introduces new technology features to support ultra high-speed and MS/RF applications incorporated into a leading-edge fully manufacturable 0.13 /spl mu/m CMOS foundry technology (K.K. Young et al, IEDM Tech Digest, pp. 563-566, 2000). New core devices with 15.5 /spl Aring/ and nominal 75 nm physical gate lengths support at least 10% performance improvement with respect to prior release. These devices offer the best I/sub off/-I/sub dsat/ performance reported so far for 1.2 V applications. To support high-speed I/O standards, additional 1.8 V-32 /spl Aring/ I/O devices are integrated with the 15.5 /spl Aring/ transistors. Leading-edge passive elements for MS/RF applications are reported in this work. Advanced Cu/low-k back end process integration that can support up to nine layers of metal is also demonstrated.